Reliability analysis of a novel design of pose deformation system for mobile robots through Bond Graph and Simulink

Jingjing Cui, Yi Ren, Dezhen Yang, Shengkui Zeng. Reliability analysis of a novel design of pose deformation system for mobile robots through Bond Graph and Simulink. In 2016 IEEE Industry Applications Society Annual Meeting, Portland, OR, USA, October 2-6, 2016. pages 1-9, IEEE, 2016. [doi]

Authors

Jingjing Cui

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Yi Ren

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Dezhen Yang

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Shengkui Zeng

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