Jingjing Cui, Yi Ren, Dezhen Yang, Shengkui Zeng. Reliability analysis of a novel design of pose deformation system for mobile robots through Bond Graph and Simulink. In 2016 IEEE Industry Applications Society Annual Meeting, Portland, OR, USA, October 2-6, 2016. pages 1-9, IEEE, 2016. [doi]
@inproceedings{CuiRYZ16,
title = {Reliability analysis of a novel design of pose deformation system for mobile robots through Bond Graph and Simulink},
author = {Jingjing Cui and Yi Ren and Dezhen Yang and Shengkui Zeng},
year = {2016},
doi = {10.1109/IAS.2016.7731854},
url = {http://dx.doi.org/10.1109/IAS.2016.7731854},
researchr = {https://researchr.org/publication/CuiRYZ16},
cites = {0},
citedby = {0},
pages = {1-9},
booktitle = {2016 IEEE Industry Applications Society Annual Meeting, Portland, OR, USA, October 2-6, 2016},
publisher = {IEEE},
isbn = {978-1-4799-8397-1},
}