An on-Communication Multiple-TSV Defects Detection and Localization for Real-Time 3D-ICs

Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran. An on-Communication Multiple-TSV Defects Detection and Localization for Real-Time 3D-ICs. In 13th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip, MCSoC 2019, Singapore, Singapore, October 1-4, 2019. pages 223-228, IEEE, 2019. [doi]

Abstract

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