Akram Ditali, Bill Black, Manny Ma, Mike Ball, Guohua Wei, J. Michael Brand. A highly reliable DRAM 3-D wafer thinning process. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 4, IEEE, 2015. [doi]
Abstract is missing.