Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses

N. Duan, T. Bach, J. Shen, R. Rongen. Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses. Microelectronics Reliability, 54(9-10):1753-1757, 2014. [doi]

Abstract

Abstract is missing.