N. Duan, T. Bach, J. Shen, R. Rongen. Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses. Microelectronics Reliability, 54(9-10):1753-1757, 2014. [doi]
@article{DuanBSR14,
title = {Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses},
author = {N. Duan and T. Bach and J. Shen and R. Rongen},
year = {2014},
doi = {10.1016/j.microrel.2014.07.112},
url = {http://dx.doi.org/10.1016/j.microrel.2014.07.112},
researchr = {https://researchr.org/publication/DuanBSR14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {9-10},
pages = {1753-1757},
}