A Novel Approach for Using TSVs As Membrane Capacitance in Neuromorphic 3-D IC

M. Amimul Ehsan, Hongyu An, Zhen Zhou, Yang Yi 0002. A Novel Approach for Using TSVs As Membrane Capacitance in Neuromorphic 3-D IC. IEEE Trans. on CAD of Integrated Circuits and Systems, 37(8):1640-1653, 2018. [doi]

Abstract

Abstract is missing.