Philip G. Emma, Alper Buyuktosunoglu, Michael B. Healy, Krishnan Kailas, Valentin Puente, Roy Yu, Allan Hartstein, Pradip Bose, Jaime H. Moreno. 3D stacking of high-performance processors. In 20th IEEE International Symposium on High Performance Computer Architecture, HPCA 2014, Orlando, FL, USA, February 15-19, 2014. pages 500-511, IEEE, 2014. [doi]
Abstract is missing.