Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending - researchr publication authors

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D. A. van den Ende, H. J. van de Wiel, R. H. L. Kusters, Ashok Sridhar, J. F. M. Schram, Maarten Cauwe, Jeroen van den Brand. Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending. Microelectronics Reliability, 54(12):2860-2870, 2014. [doi]

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