Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

D. A. van den Ende, H. J. van de Wiel, R. H. L. Kusters, Ashok Sridhar, J. F. M. Schram, Maarten Cauwe, Jeroen van den Brand. Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending. Microelectronics Reliability, 54(12):2860-2870, 2014. [doi]