Geert Eneman, J. Cho, V. Moroz, Dragomir Milojevic, M. Choi, Kristin De Meyer, Abdelkarim Mercha, Eric Beyne, Thomas Hoffmann, Geert Van der Plas. An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 505-506, IEEE, 2011. [doi]
Abstract is missing.