Furkan Eris, Ajay Joshi, Andrew B. Kahng, Yenai Ma, Saiful A. Mojumder, Tiansheng Zhang. Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon. In 2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018. pages 1441-1446, IEEE, 2018. [doi]
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