Parameter characterization of anodic bonded electrical interconnect in MEMS/NEMS devices

Xuejiao Fan, Dacheng Zhang. Parameter characterization of anodic bonded electrical interconnect in MEMS/NEMS devices. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 198-201, IEEE, 2009. [doi]

@inproceedings{FanZ09-0,
  title = {Parameter characterization of anodic bonded electrical interconnect in MEMS/NEMS devices},
  author = {Xuejiao Fan and Dacheng Zhang},
  year = {2009},
  doi = {10.1109/NEMS.2009.5068558},
  url = {http://doi.ieeecomputersociety.org/10.1109/NEMS.2009.5068558},
  researchr = {https://researchr.org/publication/FanZ09-0},
  cites = {0},
  citedby = {0},
  pages = {198-201},
  booktitle = {4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009},
  publisher = {IEEE},
  isbn = {978-1-4244-4629-2},
}