From 3D circuit technologies and data structures to interconnect prediction

Robert Fischbach, Jens Lienig, Tilo Meister. From 3D circuit technologies and data structures to interconnect prediction. In Chung-Kuan Cheng, Sherief Reda, editors, The 11th International Workshop on System-Level Interconnect Prediction (SLIP 2009), San Francisco, CA, USA, July 26-27, 2009, Proceedings. pages 77-84, ACM, 2009. [doi]

Abstract

Abstract is missing.