Simulation Methodology and Evaluation of Through Silicon Via (TSV)-FinFET Noise Coupling in 3-D Integrated Circuits

Brad D. Gaynor, Soha Hassoun. Simulation Methodology and Evaluation of Through Silicon Via (TSV)-FinFET Noise Coupling in 3-D Integrated Circuits. IEEE Trans. VLSI Syst., 23(8):1499-1507, 2015. [doi]

Abstract

Abstract is missing.