Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints

Rituparna Ghosh, Anwesha Kanjilal, Praveen Kumar. Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints. Microelectronics Reliability, 74:44-51, 2017. [doi]

Abstract

Abstract is missing.