Philipp Grubitzsch, Iris Braun, Heiko Fichtl, Thomas Springer, Tenshi Hara, Alexander Schill. ML-SLA: Multi-Level Service Level Agreements for Highly Flexible IoT Services. In IEEE International Congress on Internet of Things, ICIOT 2017, Honolulu, HI, USA, June 25-30, 2017. pages 113-120, IEEE, 2017. [doi]
Abstract is missing.