3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps

W. Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, M. Gonzalez, Yann Civale, A. Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, K. J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen. 3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. In IEEE International Conference on IC Design & Technology, ICICDT 2012, Austin, TX, USA, May 30 - June 1, 2012. pages 1-4, IEEE, 2012. [doi]

Abstract

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