Koji Hamaguchi, Mitsuki Nakata, Kouta Segawa, Naoya Suzuki, Toshihisa Nonaka. Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-6, IEEE, 2019. [doi]
Abstract is missing.