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High Density Cell Electrofusion on Chip using an Array of Non-connected Metallic Pads

Feriel Hamdi, Wei Wang, Frédéric Subra, Elisabeth Dufour-Gergam, Olivier Français, Bruno Le Pioufle. High Density Cell Electrofusion on Chip using an Array of Non-connected Metallic Pads. In Joaquim Gabriel, Carlos Manuel B. A. Correia, Ana L. N. Fred, Hugo Gamboa, editors, BIODEVICES 2012 - Proceedings of the International Conference on Biomedical Electronics and Devices, Vilamoura, Algarve, Portugal, 1 - 4 February, 2012. pages 68-72, SciTePress, 2013.

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