Auto-assign method for large scale flip-chip package design

Haitao Han, Wen Yin, Wenqian Wang, Zegui Pang. Auto-assign method for large scale flip-chip package design. In 2011 IEEE 9th International Conference on ASIC, ASICON 2011, Xiamen, China, October 25-28, 2011. pages 929-932, IEEE, 2011. [doi]

Abstract

Abstract is missing.