The Effect of Advanced Material on Multi-chip Module Electrical Properties

Assia A. Hanzaz. The Effect of Advanced Material on Multi-chip Module Electrical Properties. In Peidong Zhu, Lizhe Wang, Feng Xia, Huajun Chen, Ian McLoughlin, Shiao Li Tsao, Mitsuhisa Sato, Sun-Ki Chai, Irwin King, editors, 2010 IEEE/ACM Int'l Conference on Green Computing and Communications, GreenCom 2010, & Int'l Conference on Cyber, Physical and Social Computing, CPSCom 2010, Hangzhou, China, December 18-20, 2010. pages 922-925, IEEE, 2010. [doi]

Abstract

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