Hubert Harrer, Daniel M. Dreps, Thomas-Michael Winkel, Wolfgang Scholz, Bao G. Truong, Andreas Huber, Tingdong Zhou, Kenneth L. Christian, Gary F. Goth. High-speed interconnect and packaging design of the IBM System z9 processor cage. IBM Journal of Research and Development, 51(1/2):37-52, 2007. [doi]
Abstract is missing.