A novel TSV topology for many-tier 3D power-delivery networks

Michael B. Healy, Sung Kyu Lim. A novel TSV topology for many-tier 3D power-delivery networks. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 261-264, IEEE, 2011. [doi]

Abstract

Abstract is missing.