Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips

Tobias Hoose, M. Billah, Matthias Blaicher, P. Marin, Philipp-Immanuel Dietrich, A. Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, M. Thiel, P. Simon, J. Hoffmann, M. L. Goedecke, Wolfgang Freude, Christian Koos. Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. In Optical Fiber Communications Conference and Exhibition, OFC 2016, Anaheim, CA, USA, March 20-24, 2016. pages 1-3, IEEE, 2016. [doi]

Authors

Tobias Hoose

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M. Billah

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Matthias Blaicher

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P. Marin

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Philipp-Immanuel Dietrich

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A. Hofmann

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Ute Troppenz

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Martin Möhrle

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Nicole Lindenmann

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M. Thiel

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P. Simon

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J. Hoffmann

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M. L. Goedecke

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Wolfgang Freude

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Christian Koos

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