Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips

Tobias Hoose, M. Billah, Matthias Blaicher, P. Marin, Philipp-Immanuel Dietrich, A. Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, M. Thiel, P. Simon, J. Hoffmann, M. L. Goedecke, Wolfgang Freude, Christian Koos. Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. In Optical Fiber Communications Conference and Exhibition, OFC 2016, Anaheim, CA, USA, March 20-24, 2016. pages 1-3, IEEE, 2016. [doi]

@inproceedings{HooseBBMDHTMLTS16,
  title = {Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips},
  author = {Tobias Hoose and M. Billah and Matthias Blaicher and P. Marin and Philipp-Immanuel Dietrich and A. Hofmann and Ute Troppenz and Martin Möhrle and Nicole Lindenmann and M. Thiel and P. Simon and J. Hoffmann and M. L. Goedecke and Wolfgang Freude and Christian Koos},
  year = {2016},
  url = {http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=7537230},
  researchr = {https://researchr.org/publication/HooseBBMDHTMLTS16},
  cites = {0},
  citedby = {0},
  pages = {1-3},
  booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2016, Anaheim, CA, USA, March 20-24, 2016},
  publisher = {IEEE},
  isbn = {978-1-9435-8007-1},
}