TSV based 3D IC wire length calculation algorithm

Ligang Hou, Shu Bai, Jinhui Wang. TSV based 3D IC wire length calculation algorithm. In 2011 IEEE 9th International Conference on ASIC, ASICON 2011, Xiamen, China, October 25-28, 2011. pages 816-819, IEEE, 2011. [doi]

Abstract

Abstract is missing.