Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism

Lin Hou, Emmanuel Chery, Kristof Croes, Davide Tierno, Soon Aik Chew, Yangyin Chen, Peter Rakbin, Eric Beyne. Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 4, IEEE, 2022. [doi]

Abstract

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