Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch - researchr publication authors

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Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch. In 2013 IEEE International Test Conference, ITC 2013, Anaheim, CA, USA, September 6-13, 2013. pages 1-10, IEEE Computer Society, 2013. [doi]

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Hao Chen

Look up 'Hao Chen' in GoogleThis author has not been identified. Look up 'Chung-Han Huang' in GoogleThis author has not been identified. Look up 'Der-Jiann Liu' in GoogleThis author has not been identified. Look up 'Wei-Hsun Lin' in GoogleThis author has not been identified. Look up 'Hung-Chih Lin' in GoogleThis author has not been identified. Look up 'Ching-Nen Peng' in GoogleThis author has not been identified. Look up 'Min-Jer Wang' in Google

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