Built-in self-test/repair scheme for TSV-based three-dimensional integrated circuits

Hung-Yen Huang, Yu-Sheng Huang, Chun-Lung Hsu. Built-in self-test/repair scheme for TSV-based three-dimensional integrated circuits. In 2012 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2010, Kuala Lumpur, Malaysia, December 6-9, 2010. pages 56-59, IEEE, 2010. [doi]

Abstract

Abstract is missing.