Oscillation-Based Prebond TSV Test

Li-Ren Huang, Shi-Yu Huang, Stephen K. Sunter, Kun-Han Tsai, Wu-Tung Cheng. Oscillation-Based Prebond TSV Test. IEEE Trans. on CAD of Integrated Circuits and Systems, 32(9):1440-1444, 2013. [doi]

Abstract

Abstract is missing.