Li-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng. Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 33(3):476-488, 2014. [doi]
Abstract is missing.