Yu-Chieh Huang, Bing-Yang Lin, Cheng-Wen Wu, Mincent Lee, Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package. In Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016. pages 58, ACM, 2016. [doi]
Abstract is missing.