Zhengfeng Huang, Zian Su, Tianming Ni, Qi Xu, Haochen Qi, Yingchun Lu, Manzi Eric, Hui Xu. Cross-Layer Dual Modular Redundancy Hardened Scheme of Flip-Flop Design Based on Sense-Amplifier. Journal of Circuits, Systems, and Computers, 30(5), 2021. [doi]
Abstract is missing.