Patrick Iff, Maciej Besta, Matheus A. Cavalcante, Tim Fischer 0001, Luca Benini, Torsten Hoefler. HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement. In 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023. pages 1-6, IEEE, 2023. [doi]
Abstract is missing.