Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura. An image sensor/processor 3D stacked module featuring ThruChip interfaces. In 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017. pages 7-8, IEEE, 2017. [doi]
Abstract is missing.