Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding

A. Ikeda, L. J. Qiu, K. Nakahara, T. Asano. Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]

Authors

A. Ikeda

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L. J. Qiu

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K. Nakahara

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T. Asano

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