A. Ikeda, L. J. Qiu, K. Nakahara, T. Asano. Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]