Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin. A 3D micro-channel cooling system embedded in LTCC packaging substrate. In 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012. pages 649-652, IEEE, 2012. [doi]
Abstract is missing.