Li Jiang, Yuxi Liu, Lian Duan, Yuan Xie, Qiang Xu. Modeling TSV open defects in 3D-stacked DRAM. In Ron Press, Erik H. Volkerink, editors, 2011 IEEE International Test Conference, ITC 2010, Austin, TX, USA, November 2-4, 2010. pages 174-182, IEEE, 2010. [doi]
Abstract is missing.