Fault isolation of short defect in through silicon via (TSV) based 3D-IC

Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi. Fault isolation of short defect in through silicon via (TSV) based 3D-IC. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]

Abstract

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