Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim. Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. In 2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, California, USA, November 7-10, 2011. pages 563-570, IEEE, 2011. [doi]
Abstract is missing.