Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design

M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng. Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design. In Yiran Chen, Victor V. Zhirnov, Avesta Sasan, Ioannis Savidis, editors, GLSVLSI '21: Great Lakes Symposium on VLSI 2021, Virtual Event, USA, June 22-25, 2021. pages 135-140, ACM, 2021. [doi]

Abstract

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