High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices

Shigeru Kanazawa, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshihiro Ogiso, Johsuke Ozaki, Takahiko Shindo, Satoshi Tsunashima, Hiromasa Tanobe, Atsushi Araratake. High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices. IEICE Transactions, 102-C(4):340-346, 2019. [doi]

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