High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices

Shigeru Kanazawa, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshihiro Ogiso, Johsuke Ozaki, Takahiko Shindo, Satoshi Tsunashima, Hiromasa Tanobe, Atsushi Araratake. High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices. IEICE Transactions, 102-C(4):340-346, 2019. [doi]

@article{KanazawaYUKOOST19,
  title = {High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices},
  author = {Shigeru Kanazawa and Hiroshi Yamazaki and Yuta Ueda and Wataru Kobayashi and Yoshihiro Ogiso and Johsuke Ozaki and Takahiko Shindo and Satoshi Tsunashima and Hiromasa Tanobe and Atsushi Araratake},
  year = {2019},
  url = {http://search.ieice.org/bin/summary.php?id=e102-c_4_340},
  researchr = {https://researchr.org/publication/KanazawaYUKOOST19},
  cites = {0},
  citedby = {0},
  journal = {IEICE Transactions},
  volume = {102-C},
  number = {4},
  pages = {340-346},
}