Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

Nauman H. Khan, Syed M. Alam, Soha Hassoun. Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies. IEEE Trans. VLSI Syst., 19(4):647-658, 2011. [doi]

Abstract

Abstract is missing.