Kumail Khurram, Asisa Kumar Panigrahi, Satish Bonam, Om Krishan Singh, Shiv Govind Singh. Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
Abstract is missing.