Dae-Hyun Kim, Krit Athikulwongse, Sung Kyu Lim. A study of Through-Silicon-Via impact on the 3D stacked IC layout. In 2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA. pages 674-680, IEEE, 2009. [doi]
Abstract is missing.