Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout

Dae-Hyun Kim, Krit Athikulwongse, Sung Kyu Lim. Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout. IEEE Trans. VLSI Syst., 21(5):862-874, 2013. [doi]

Abstract

Abstract is missing.