7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip

Hyun-Jin Kim, Jeong-Don Lim, Jang-Woo Lee, Dae-Hoon Na, Joon-Ho Shin, Chae-Hoon Kim, Seungwoo Yu, Ji-Yeon Shin, Seon-Kyoo Lee, Devraj Rajagopal, Sang-Tae Kim, Kyeong-Tae Kang, Jeong-Joon Park, Yongjin Kwon, Min-Jae Lee, Sunghoon Kim, Seunghoon Shin, Hyung Gon Kim, Jin Tae Kim, Ki-Sung Kim, Han Sung Joo, Chan-Jin Park, Jae-Hwan Kim, Man-Joong Lee, Do-Kook Kim, Hyang-Ja Yang, Dae-Seok Byeon, Ki Tae Park, Kyehyun Kyung, Jeong-Hyuk Choi. 7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip. In 2015 IEEE International Solid-State Circuits Conference, ISSCC 2015, Digest of Technical Papers, San Francisco, CA, USA, February 22-26, 2015. pages 1-3, IEEE, 2015. [doi]

Abstract

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